J. B. ENGINEERING
Copper Plating Bath

Copper Plating Bath

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A smooth performing Copper Plating Bath for rotogravure plant is provided to our customers from our end. This machine is available in both automatic and manual anode versions. Available with a vecu type tank, this machine is available in length of  1300/1800/2200 m and and a plating diameter of 120-350. Moreover, it has normal current and carbon cooling plating time of 120 micron/60 minutes. Our Copper Plating Bath is also offered to our customers in customized options as per the needs. 

Key points:

  • Provides aid for imparting finely finished steampunk look on metallic surfaces
  • Enhances corrosion resistance on metals
  • Robust design that leads to high durability
  • Simple to maintain and use
  • Keeps buffer solution at appropriate temperature for stabilizing pH
  • Facilitates in improving conductivity

Further Details:

The superior performing ambit of copper baths for rotogravure plant is provided to our customers from our end. These are accessible in manual as well as automatic electrode adjustment variations, with a vecu variety tank and the length of 1300/1800/2200 m. A and M plating diameter of 120-350. The baths has a average current transfer as well as a carbon cooling plating case :120 micron/60 minutes. We made these by employing the best quality components and offer these in customized as per the demands and specifications of our customers.